8D Report Examples — Real Cases & Templates

Real 8D Report Examples This page collects real 8D report examples from automotive, electronics, and manufacturing industries. Each example demonstrates the complete D0-D8 structure with genuine root cause analysis aligned with IATF 16949 Clause 10.2 and AIAG core tool requirements. Example 1: PCB Solder Crack (Electronics Manufacturing) D0 — Emergency Response: 1,200 units of Lot#A382 quarantined at warehouse. Customer notified within 2 hours. D1 — Team: J. Zhang (QE Lead), M. Chen (Design), R. Patel (Process), S. Kumar (Supplier Quality) D2 — Problem Description (5W2H): What: 0.3mm radial crack at P3 solder joint causing intermittent open circuit Where: Detected at customer final test, located on PCB FET switching area When: Lot#A382, Night Shift 2026-03-15, detected 2026-03-28 How Many: 8/200 boards (4% failure rate, 40,000 PPM) How Detected: Customer accelerated life test — thermal cycling failure D3 — Containment: 100% X-ray inspection of all Lot#A382 units (1,200 units) Additional 200% inspection for next 3 production lots Clean point: Serial#A382-1201 (first unit after corrective action) D4 — Root Cause (5-Why): Why solder crack? → Void >25% in FET drain pad solder joint Why >25% void? → Reflow profile temperature ramp too fast Why too fast? → Oven zone 3 thermocouple reading 15°C...